Mass Lamination Service - Taiwan Union Technology ...
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Mass Lamination Service. To focus on PCB applications in impedance controlled, HDI and high layer count designs, TUC offers customer not only a total solution ... MassLaminationService TofocusonPCBapplicationsinimpedancecontrolled,HDIandhighlayercountdesigns,TUCofferscustomernotonlyatotalsolutioncombinedfacilityfromCCLexpertiseandPCBinterlayerprocesses,butalsoproductionflexibilityandcostsavings. TUCusescuttingedgeequipmenttoprovidemasslaminationservicetoglobalPCBmanufacturers–fromimagetransfertoautomaticbuild-uptoopticalinspection.Focusingonapplicationswithimpedancecontrol,HDI-designsandhighlayercounts,TUCofferscustomersnotonlyatotalsolutionwithCCLexpertiseandPCBinnerlayerprocesses,butalsoproductionflexibilityandcostsavings.BetweenTUC’sTaiwanandChangshuplants,totalmanufacturingcapacityexceeds2,400,000squarefeetpermonth. MassLaminationService ViewProductsbyProperty ViewProductsbyApplications SlashSheet ULCertification MassLaminationService ProcessCapability Minlinewidth/space:2/2milsoverHoz Layerregistration:4mils Toolingholedistance:±2mils MinNCdrillingsize:8mils NCdrillingregistration:2mils Maxworkingsize:23.8x27.8inches Minthickness:10mils(4L),16mils(6L),22mils(8L),28mils(10L),34mils(12L) Maxthickness:300mils Maxlayercount:32layers Applications ≥18layersPCBforservers,backpanelsandbasestations. 10~16layersPCBforbackpanels,basestations,switches,routersandservers. 6~8layersPCBforDDRmodules,HDD,LCDandgraphicscards. 4layersPCBforautomotive,LCDapplications,HDIdesignsandmotherboards. TOP
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- 5製造流程
製程概述 · 黏合片(Prepreg，亦稱膠片) · 銅箔基板(Copper Clad Laminate，簡稱CCL) · 多層壓合代工服務(Mass Lamination Service).
