CN203788552U - 一种铁氟龙高频电路板- Google Patents

本实用新型公开了一种铁氟龙高频电路板，其技术方案的要点包括有铁氟龙基板，所述铁氟龙基板由多个单元板拼凑而成，所述铁氟龙基板上下两面分别设有上覆铜线路层和下覆 ... CN203788552U-一种铁氟龙高频电路板 -GooglePatents 一种铁氟龙高频电路板 DownloadPDF Info Publicationnumber CN203788552U CN203788552U CN201420138203.2U CN201420138203U CN203788552U CN203788552U CN203788552U CN203788552U CN201420138203U CN201420138203U CN201420138203U CN203788552U CN203788552U CN203788552U Authority CN China Priorartkeywords teflon circuitboard copper substrate teflonsubstrate Priorartdate 2014-03-25 Legalstatus(Thelegalstatusisanassumptionandisnotalegalconclusion.Googlehasnotperformedalegalanalysisandmakesnorepresentationastotheaccuracyofthestatuslisted.) Expired-FeeRelated Applicationnumber CN201420138203.2U Otherlanguages English(en) Inventor 黄烨 侯建红 谢兴龙 CurrentAssignee(Thelistedassigneesmaybeinaccurate.Googlehasnotperformedalegalanalysisandmakesnorepresentationorwarrantyastotheaccuracyofthelist.) GUANGZHOUTATCHUNELECTRONICSCOLtd OriginalAssignee GUANGZHOUTATCHUNELECTRONICSCOLtd Prioritydate(Theprioritydateisanassumptionandisnotalegalconclusion.Googlehasnotperformedalegalanalysisandmakesnorepresentationastotheaccuracyofthedatelisted.) 2014-03-25 Filingdate 2014-03-25 Publicationdate 2014-08-20 2014-03-25 ApplicationfiledbyGUANGZHOUTATCHUNELECTRONICSCOLtd filed Critical GUANGZHOUTATCHUNELECTRONICSCOLtd 2014-03-25 PrioritytoCN201420138203.2U priority Critical patent/CN203788552U/zh 2014-08-20 Applicationgranted granted Critical 2014-08-20 PublicationofCN203788552U publication Critical patent/CN203788552U/zh Links Espacenet GlobalDossier Discuss 229920001343 polytetrafluoroethylene Polymers 0.000 title claims abstract description 66 239000004809 Teflon Substances 0.000 title claims abstract description 60 239000000758 substrate Substances 0.000 claims abstract description 45 RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemicalcompound 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O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1 229920001568 phenolicresin Polymers 0.000 description 1 239000005011 phenolicresin Substances 0.000 description 1 230000000704 physicaleffect Effects 0.000 description 1 231100000719 pollutant Toxicity 0.000 description 1 230000002000 scavenging Effects 0.000 description 1 238000009834 vaporization Methods 0.000 description 1 Abstract 本实用新型公开了一种铁氟龙高频电路板，其技术方案的要点包括有铁氟龙基板，所述铁氟龙基板由多个单元板拼凑而成，所述铁氟龙基板上下两面分别设有上覆铜线路层和下覆铜线路层，所述铁氟龙基板边缘设有用于曝光的对位孔，在电路板上设有能贯通所述上覆铜线路层、铁氟龙基板和下覆铜线路层的导通孔，所述导通孔内设有导通上覆铜线路层和下覆铜线路层的导电铜箔，所述铁氟龙基板空旷位置设有增加铁氟龙基板硬度的铜块。

本实用新型在基板空旷位置设置附加铜块，附加铜块的存在相当于增加了铁氟龙基板的硬度，有效防止电路板在加工的过程中产生的板翘、板弯等问题，有效保证了电路板在电镀铜过程中的导电均匀性，使电路板的成品率有效提高。

Description 一种铁氟龙高频电路板 【技术领域】 [0001] 本实用新型涉及一种电路板，尤其是涉及一种铁氟龙高频电路板。

【背景技术】 [0002] 高频电路板在无线网络、卫星通讯等领域应用越来越广泛，一般来说，高频电路板为频率在IGHz以上的电路板。

高频电路板基板在选材时有以下几点要求:介电常数(Dk)小而且很稳定，介质损耗(Df)小，吸水性低，耐热性、抗化学性、冲击强度、剥离强度等亦必须良好。

目前常用的基板材料有环氧树脂、PPO树脂和氟系树脂等三大类，这三类基材物性对比如下: [0003] 环氧树脂成本最便宜，氟系树脂最昂贵，而以介电常数、介质损耗、吸水率和频率特性来考虑，氟系树脂最佳，环氧树脂较差，PPO树脂只能用于IGHz~IOGHz之间的产品上，当产品应用的频率超过IOGHz时，只有氟系树脂印制板才能适用。

显而易见，氟系树脂高频基板性能高于其它基板，氟糸树脂基板中常用的有聚四氟乙烯(PTFE)板，又称铁氟龙板，其不足之处是刚性较差，另因聚四氟乙烯树脂本身的分子惰性，造成基板不容易与铜箔粘合，现有技术的铁氟龙高频电路板没能很好地解决这一问题。

【实用新型内容】 [0004] 本实用新型目的是克服了现有技术的不足，提供一种硬度好、不易弯曲变形、且与铜猜能良好粘合的铁氣龙闻频电路板。

[0005] 本实用新型是通过以下技术方案实现的: [0006] 一种铁氟龙高频电路板，其特征在于:包括有铁氟龙基板1，所述的铁氟龙基板I由多个单元板拼凑而成，所述的铁氟龙基板I上下两面分别设有上覆铜线路层2和下覆铜线路层3，所述铁氟龙基板I边缘设有用于曝光的对位孔4，在电路板上设有能贯通所述上覆铜线路层2、铁氟龙基板I和下覆铜线路层3的导通孔6，所述导通孔6内设有导通上覆铜线路层2和下覆铜线路层3的导电铜箔，所述铁氟龙基板I空旷位置还设有增加铁氟龙基板I硬度的铜块5。

[0007] 如上所述的铁氟龙高频电路板，其特征在于:所述导通孔6内的导电铜箔和上覆铜线路层2、下覆铜线路层3的导电铜箔Ra值为0.9um以上，剥离强度值为10Ib/In以上。

[0008] 如上所述的铁氟龙高频电路板，其特征在于:所述的对位孔4为环形靶孔。

[0009] 如上所述的铁氟龙高频电路板，其特征在于:所述的铁氟龙基板I由聚四氟乙烯、玻璃纤维布制成。

[0010] 与现有技术相比，本实用新型有如下优点: [0011] 1、本实用新型铁氟龙高频电路板采用多个电路板单元相连设计，成型时用右旋式双刃刀分开相连成品单元，有效提高了基板的利用率，节省了生产成本；同时避免了铣板时铁氟龙板材易变形而影响尺寸等品质缺陷，还减少批锋毛刺的出现。

[0012] 2、本实用新型铁氟龙高频电路板对位孔避免了在干膜工序使用负片曝光时的对位难度，提高了产品的良率，减少了因层间错位而导致的板子报废率。

[0013] 3、本实用新型铁氟龙高频电路板在基板空旷位置设置附加铜块，附加铜块的存在相当于增加了铁氟龙基板的硬度，有效防止了电路板在加工过程中产生的板翘、板弯等问题，保证了电路板在电镀铜过程中的导电均匀性，使电路板的成品率有效提高。

[0014] 4、本实用新型铁氟龙高频电路板通过采用等离子清洗处理以及增加铜箔的粗糙度和剥离强度，有效解决了铁氟龙基板不易与铜箔粘合的问题。

【附图说明】 [0015] 图1是本实用新型立体示意图； [0016] 图2是本实用新型图1中A-A的剖面示意图。

[0017] 图中:1为铁氟龙基板；2为上覆铜线路层；3为下覆铜线路层；4为对位孔；5为铜块；6为导通孔； 【具体实施方式】 [0018] 下面结合附图对本实用新型作进一步描述: [0019] 一种铁氟龙高频电路板，包括有铁氟龙基板1，所述的铁氟龙基板I由多个单元板拼凑而成，所述的铁氟龙基板I由聚四氟乙烯、玻璃纤维布制成。

[0020] 所述的铁氟龙基板I上下两面分别设有上覆铜线路层2和下覆铜线路层3，所述铁氟龙基板I边缘设有用于曝光的对位孔4，所述的对位孔4为环形靶孔，在干膜工序中，因为负片菲林上黑色区域较多，很难对位，干膜曝光时，负片菲林用此环形靶孔及附近的基材线条对位，能很好的解决负片工艺对位难的问题，在电路板上设有能贯通所述上覆铜线路层2、铁氟龙基板I和下覆铜线路层3的导通孔6，经沉铜板电工序在所述导通孔6内设有导通上覆铜线路层2和下覆铜线路层3的导电铜箔，实现基板两面铜层的导通。

但在沉铜工序之前需要用等离子清洗处理，否则板电工艺易出现孔无铜、孔内树脂空洞等缺陷。

等离子清洗也在一定程度上解决了铁氟龙基板不容易与铜箔结合的问题，所述等离子清洗的步骤如下: [0021] 1、将被清洗的电路板送入真空室并固定，排出真空室内的空气至0.1-0.2torr,torr为压强单位，中文译为托，I托定为标准大气压力的1/760倍； [0022] 2、向真空室引入等离子清洗用的气体使其压力保持在0.15_0.25tOrr，根据清洗材质的不同，清洗用的气体可分别选用氧气、氢气、氩气或氮气等气体； [0023] 3、在真空室内施加无线电波范围内的高频电压产生等离子体对电路板进行清洗，清洗时间为几十秒到几十分钟； [0024] 4、清洗完毕，切断高频电压，排出气体及汽化的污垢，同时向真空室内鼓入空气，使其气压升至一个大气压。

[0025] 所述等离子清洗对比传统的药水除胶工艺有以下几个方面的优势: [0026] a)在经过等离子清洗以后，电路板板面已经很干燥，不必再经干燥处理即可送往下道工序。

[0027] b)等离子清洗工艺不使用有机溶剂、挥发性药水等有害液体，清洗后也不会产生有害污染物，属于有利于环保的绿色清洗方法。

[0028] c)采用无线电波范围内的高频放电产生的等离子体进行清洗，其方向性不强，可深入电路板的微细孔眼和凹陷的内部完成清洗任务，不受被清洗物体形状的影响，对那些较难清洗部位的清洗效果会更好。

[0029] d)等离子清洗需要控制的真空度为0.15-0.25t0rr，这种真空度在工厂生产中很容易实现。

设备成本不高，清洗过程也不需要使用价格昂贵的有机溶剂或其它药水，故等离子清洗运行成本远低于传统的除胶工艺。

[0030] e)由于等离子清洗不需要对清洗液进行运输、贮存、排放等处理措施，所以生产场地容易保持清洁卫生。

[0031] f)等离子清洗是在真空条件下对电路板表面进行清洗，不会接触任何有机溶剂或药水，可有效避免孔无铜、电路板开路等缺陷的产生，提升产品优良率，从而节省公司生产成本。

[0032] 另外为进一步提高铜箔与基板的结合力，本实用新型所述导通孔6内的导电铜箔和上覆铜线路层2、下覆铜线路层3的导电铜箔要求单独处理，处理后的导电铜箔Ra达到 0.9um以上，剥离强度达到10Ib/In以上。

[0033] 为解决铁氟龙基板较软、易变形弯曲的问题，本实用新型在所述铁氟龙基板I空旷位置设有能增加铁氟龙基板I硬度的铜块5。

有效防止了电路板在加工的过程中产生的板翘、板弯等问题，而且有效保证了电路板在电镀铜过程中的导电均匀性，使电路板的成品率有效提闻。

[0034] 在最后的成型锣板工序中，将由多个单元板拼凑成的电路板用硬质金属材料制成的右旋式双刃铣刀锣出成品单元外形；由于铁氟龙板材结构类似为玻纤网，普通刀铣板时会把玻纤拉出来而不易铣断开，本实用新型的右旋式双刃刀则可避免此问题出现，且在电路板上下两面均垫有酚醛树脂垫板。

把铁氟龙板夹在中间，相当于增加了板材的硬度，避免了铣板时铁氟龙板材变形而影响尺寸等品质缺陷，铣板的同时再调整各铣板参数，比如降低下刀速、增加转速、降低行进速度等可减少批锋毛刺的出现。

Claims(4) 1.一种铁氟龙高频电路板，其特征在于:包括有铁氟龙基板(1)，所述的铁氟龙基板(I)由多个单元板拼凑而成，所述铁氟龙基板(I)上下两面分别设有上覆铜线路层(2)和下覆铜线路层(3)，所述铁氟龙基板(I)边缘设有用于曝光的对位孔(4)，在电路板上设有能贯通所述上覆铜线路层(2)、铁氟龙基板(I)和下覆铜线路层(3)的导通孔(6)，所述导通孔(6)内设有导通上覆铜线路层(2)和下覆铜线路层(3)的导电铜箔，所述铁氟龙基板(I)空旷位置设有增加铁氟龙基板(I)硬度的铜块(5)。

2.根据权利要求1所述的铁氟龙高频电路板，其特征在于:所述导通孔(6)内的导电铜箔和上覆铜线路层(2)、下覆铜线路层(3)的导电铜箔Ra值为0.9um以上，剥离强度值为lOIb/Ιη以上。

3.根据权利要求1所述的铁氟龙高频电路板，其特征在于:所述的对位孔(4)为环形靶孔。

4.根据权利要求1所述的铁氟龙高频电路板，其特征在于:所述的铁氟龙基板(I)由聚四氟乙烯、玻璃纤维布制成。

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